RCO-3000-CML

The RCO-3000-CML Series bringing powerful compute power to harsh industrial settings. At the heart of the RCO-3000-CML Series is Intel’s 10th Generation advanced processors (codename: Comet Lake S) and Q470E Chipset, enabling advanced processing in volatile, demanding, and mobile deployments.

System
Processor	Support 10th Gen Intel® CML S Processor (LGA 1200, 35W TDP) - Intel® Core™ i9-10900TE, 10 Cores, 20MB Cache, up to 4.5 GHz, TDP 35W - Intel® Core™ i7-10700TE, 8 Cores, 16MB cache, up to 4.4 GHz, TDP 35W - Intel® Core™ i5-10500TE, 6 Core, 12MB Cache, up to 3.7 GHz, TDP 35W - Intel® Core™ i3-10100TE, 4 Cores, 9MB Cache, up to 3.6 GHz, TDP 35W - Intel® Pentium® G6400TE, 2 Cores, 4MB Cache, 3.2 GHz, TDP 35W - Intel® Celeron® G5900TE, 2 Cores, 2MB Cache, 3.0 GHz, TDP 35W
System Chipset	Intel® Q470E Express Chipset
LAN Chipset	GbE1: Intel I219 (Support Wake-on-LAN and PXE) 2.5 GbE2: Intel I225 (Support Wake-on-LAN and PXE)
Audio Codec	Realtek ALC888S
System Memory	2x 260-Pin DDR4 2666/2933MHz SODIMM. Max. up to 64GB
BIOS	AMI 256Mbit SPI BIOS
Watchdog	Software Programmable Supports 1~255 sec. System Reset
TPM	TPM 2.0

 

Display
DisplayPort	3x DisplayPort, support resolution 4096 x 2304 (1x DP Port Co-layout HDMI Connector)
HDMI	Yes, Shared by 1x DP port
Multiple Display	Triple Display

 

Storage
mSATA	1x mSATA
SIM Socket	2x External SIM socket (Mini PCIe attached)
SSD/HDD	1x Internal 2.5" SATA HDD Bay (support H=9mm) 1x Removable 2.5" SATA HDD Bay (support H=7mm, hot-swappable) Support RAID 0, 1, 5

 

Expansion
M.2	1x M.2 (E Key, PCIe x1, USB 2.0, 2230), 1x M.2 B Key, 2242/3042/3052 (PCIex2, Support AI Module/NVMe Storage) (PCIex1&USB 3.2 Gen1, Support 4G/5G)
Mini PCIe	1x Full-size Mini PCIe
Expansion Modules	Occupied One Universal I/O Slot: • 4-port GbE module with Intel® I350 Chipset, RJ-45 or M12 connector (PoE optional) • 2-Port 10GbE RJ45 with Intel X710 Chipset • 4-Port USB with Renesas uPD720201K8 host controller (share PCIe Gen2 x1 bandwidth) • 1x M.2 M-Key (PCIe x4 Lane, 2242/2260) for NVMe/AI Module • 2x M.2 B-Key 2242/3042/3052:   - 2x M.2 (PCIe x2 Lane) for NVMe/AI Module   - 1x M.2 (PCIe x2 Lane) for NVMe/AI Module and 1x M.2 (PCIe x1 Lane + USB 3.2 Gen 1) for 4G/5G Module, 1x External SIM socket (M.2 attached)

 

Operating System
Windows	Windows 10
Linux	Linux kernel

 

I/O
Audio	1x Line-out
CAN	2x CAN 2.0 A/B 2-pin Internal header
COM	3x RS-232/422/485 ; 2x RS-232/422/485 (internal)
DIO	8 in / 8 out (Isolated)
LAN	2x RJ45
Universal I/O Bracket	1x Universal I/O Bracket (By mini PCIe interface)
USB	6x USB 3.2 Gen 2 (10Gbps) 1x USB 3.2 Gen 1 (5 Gbps, internal) 1x USB 2.0 (internal)
Others	5x WiFi Antenna Holes 1x Power Switch, 1x AT/ATX Switch, 1x Remote Power On/Off 1x PC/Car Mode Switch, 1x Delay Time Switch 1x CMOS Battery 1x 4-Pin FAN Connector

 

Power
Power Mode	AT, ATX
Power Supply Voltage	9~48VDC
Power Ignition Sensing	Power Ignition Management
Power Connector	3-pin Terminal Block
Power Adaptor	Optional AC/DC 24V/5A, 120W Optional AC/DC 24V/9.2A, 220W
Power Protection	OVP (Over Voltage Protection) OCP (Over Current Protection) Reserve Protection

 

Environment
Operating Temp.	-25°C to 70°C (35W CPU)
Storage Temp.	-30°C to 85°C
Relative Humidity	10% to 95% (non-condensing)
Vibration	IEC60068-2-64:2008 With HDD: 1 Grms (5 - 500 Hz, 0.5 hr/axis) With SSD: 5 Grms (5 - 500 Hz, 0.5 hr/axis) Designed to comply with MIL-STD-810G Method 514.7 Procedure I
Shock	IEC60068-2-27:2008 With SSD: 50G half-sin 11ms Designed to comply with MIL-STD-810G Method 516.7 Procedure I
Standards / Certification	UL, CE, FCC Class A, EMC Conformity with EN50155 & EN50121-3-2

 

Physical
Construction	Extruded Aluminum with Heavy Duty Metal
Dimension	192 (W) x 227 (D) x 60.3 (H) mm
Weight	3.3kg - 4.1 kg
Mounting	Wall Mounting

 

• For 10th CPUs configured to run at 35W, operating temperatures will be limited to 70°C.
• 35W CPUS may experience thermal throttling depending on extreme application workloads; this is also due to an increase in the physical CPU cores from the Intel silicon (up to 10 cores). Please note, this does not indicate system malfunction or problems in the fanless design. Please consult our embedded engineers for the best configuration to match your application requirements.
• All specifications and photos are subject to change without notice.

Available Models
RCO-3000-CML	Advanced Fanless Embedded System w/ LGA 1200 for Intel® 10th Gen CPU & Q470E PCH, 2x LAN
RCO-3000-CML-4L	Advanced Fanless Embedded System w/ LGA 1200 for Intel® 10th Gen CPU & Q470E PCH, 6x LAN
RCO-3000-CML-4LM12	Advanced Fanless Embedded System w/ LGA 1200 for Intel® 10th Gen CPU & Q470E PCH, 2x LAN, 4x M12 LAN
RCO-3000-CML-4P	Advanced Fanless Embedded System w/ LGA 1200 for Intel® 10th Gen CPU & Q470E PCH, 2x LAN, 4x PoE
RCO-3000-CML-4PM12	Advanced Fanless Embedded System w/ LGA 1200 for Intel® 10th Gen CPU & Q470E PCH, 2x LAN, 4x M12 PoE
RCO-3000-CML-D10G	Advanced Fanless Embedded System w/ LGA 1200 for Intel® 10th Gen CPU & Q470E PCH, 2x LAN, 2x 10G LAN
RCO-3000-CML-4U3	Advanced Fanless Embedded System w/ LGA 1200 for Intel® 10th Gen CPU & Q470E PCH, 2x LAN, 10x USB
RCO-3000-CML-M2MK	Advanced Fanless Embedded System w/ LGA 1200 for Intel® 10th Gen CPU & Q470E PCH, 2x LAN, 1x M.2 M Key
RCO-3000-CML-2M2BK	Advanced Fanless Embedded System w/ LGA 1200 for Intel® 10th Gen CPU & Q470E PCH, 2x LAN, 3x M.2 B Key

 

Ordering Information
1-E09A12002	Adapter AC/DC 24V 5A 120W with 3pin Terminal Block Plug 5.0mm Pitch
1-E09A22102	Adapter AC/DC 24V 9.2A 220W with 3pin Terminal Block Plug 5.0mm Pitch
1-TPCD00005	Power Cord, 3-pin US Type, 180cm
1-TPCD00002	Power Cord, European Type
1-TPCD00001	Power Cord, 3-pin UK Type, 180cm

 

Packing List
1x RCO-3000-CML
1x Wall Mount Kit
1x Accessory Kit